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 ICS558-01
PECL/CMOS TO CMOS CLOCK DIVIDER
Description
The ICS558-01 accepts a high speed input of either PECL or CMOS, integrates a divider of 1, 2, 3, or 4, and provides four CMOS low skew outputs. The chip also has output enables so that one, three, or all four outputs can be tri-stated. The ICS558-01 is a member of the ICS Clock BlocksTM family of clock generation, synchronization, and distribution devices.
Features
* * * * * * * * * *
16-pin TSSOP package Available in Pb (lead) free package Selectable PECL or CMOS inputs Operates up to 250 MHz Works as a voltage translator Four low skew (<250 ps) outputs Selectable internal divider Operating input voltages of 3.3 V or 5.0 V Operating output voltages of 2.5 V, 3.3 V or 5.0 V Ideal for IA64 designs
Block Diagram
VDDP VDDC OE0
PECLIN PECLIN CLK1 CLK2 Output Divide CLK3 CLK4
1 CMOSIN SELPECL S0, S1 2 0
GND
GND
OE1
MDS 558-01 C I n t e gra te d C i r c u i t S y s t e m s
1
525 Race Stre et, San Jo se, CA 9 5126
Revision 122105 te l (40 8) 2 97-12 01
w w w. i c st . c o m
ICS558-01 PECL/CMOS TO CMOS CLOCK DIVIDER
Pin Assignment
S0 S1 VDDP PECLIN PECLIN GND CMOSIN OE0 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 SELPECL VDDC CLK1 CLK2 CLK3 CLK4 GND OE1
Input Clock Selection
SELPECL 0 1 Input CMOSIN PECLIN
Tri-State Table
OE1 0 0 1 1 OE0 0 1 0 1 CLK 1 Tri-state Clock ON Tri-state Clock ON CLK 2, 3, 4 Tri-state Tri-state Clock ON Clock ON
16-pin 173 Mil (0.65mm) TSSOP
Output Divide Selection
S1 0 0 1 1 S0 0 1 0 1 Output Divide /1 /2 /3 /4
Pin Descriptions
Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Name S0 S1 VDDP PECLIN PECLIN GND CMOSIN OE0 OE1 GND CLK4 CLK3 CLK2 CLK1 VDDC SELPECL Pin Type Input Input Power Clock Input Clock Input Power Clock Input Input Input Power Output Output Output Output Power Input Pin Description Select 0 for output divider. See table above. Internal pull-up to VDDP. Select 1 for output divider. See table above. Internal pull-up to VDDP. Connect to +3.3 V or +5 V. Decouple to pin 6. PECL input. Connect to ground if not used. Complimentary PECL input. Connect to ground if not used. Connect to ground. CMOS input. Connect to ground if not used. Output Enable 0. See table above. Internal pull-up to VDDP. Output Enable 1. See table above. Internal pull-up to VDDP. Connect to ground. Low skew clock output. Low skew clock output. Low skew clock output. Low skew clock output. Connect to +2.5 V, +3.3 V, or +5 V. Decouple to pin 10. Selects PECL or CMOS input. See table above. Internal pull-up to VDDP.
MDS 558-01 C In te grated Circuit Systems
2
525 Ra ce Street, San Jose, CA 9512 6
Revision 122105 tel (4 08) 297-1 201
w w w. i c s t . c o m
ICS558-01 PECL/CMOS TO CMOS CLOCK DIVIDER
External Components
The ICS558-01 requires two 0.01 F capacitors between VDDP and GND, and VDDC and GND--one on each side of the chip. These must be close to the chip to minimize lead inductance. Series termination resistors of 33 can be used on the outputs (these also must be close to the chip).
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS558-01. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.
Item
Supply Voltage; VDDP, VDDC (referenced to ground) Inputs and Clock Outputs (referenced to ground) Ambient Operating Temperature Storage Temperature Soldering Temperature (maximum of 10 seconds) 7.0 V
Rating
-0.5 V to VDD+0.5 V 0 to +70 C -65 to +150 C 260 C
DC Electrical Characteristics
VDDP = VDDC = 3.3V (unless stated otherwise), Ambient temperature 0 to +70 C
Parameter
Operating Voltage, VDDP Operating Voltage, VDDC Input High Voltage, CMOSIN Input Low Voltage, CMOSIN Input High Voltage Input Low Voltage Common Mode Range, PECLIN Common Mode Range, PECLIN Peak-to-Peak Input Voltage, PECLIN Output High Voltage Output Low Voltage Output High Voltage
Symbol
Conditions
Min.
3.0 2.375 (VDDP/2)+1
Typ.
Max.
5.5 VDDP (VDDP/2)-1
Units
V V V V V V V V V V
VDDC VDDP VDDC
VDDP VIH VIL VIH VIL non-clock pins non-clock pins VDDP=5 V VDDP=3.3 V
VDDP-0.5 VDDP-3.7 VDDP-2.0 0.3
VDDP 0.5 VDDP-0.6 VDDP-0.6 1.0
VOH VOL VOH
VDDC = 5 V, IOH = -24 mA VDDC = 5 V, IOL = 24 mA VDDC = 3.3 V, IOH = -18 mA
VDDC-0.4 0.4 VDDC-0.4
V V
MDS 558-01 C In te grated Circuit Systems
3
525 Ra ce Street, San Jose, CA 9512 6
Revision 122105 tel (4 08) 297-1 201
w w w. i c s t . c o m
ICS558-01 PECL/CMOS TO CMOS CLOCK DIVIDER
Parameter
Output Low Voltage Output High Voltage Output Low Voltage Operating Supply Current Operating Supply Current Short Circuit Current On-chip pull-up resistor Input Capacitance
Symbol
VOL VOH VOL IDDP IDDC
Conditions
VDDC = 3.3 V, IOL = 18 mA VDDC = 2.5 V, IOH = -8 mA VDDC = 2.5 V IOL = 8 mA No load, 100 MHz input No load, 100 MHz input
Min.
Typ.
Max.
0.4
Units
V V
VDDC-0.4 0.4 22 18 +70
V mA mA mA k pF
RPU CIN
250 4
AC Electrical Characteristics
VDDP = VDDC = 3.3 V (unless stated otherwise), Ambient Temperature 0 to +70 C
Parameter
Input Frequency Output Rise Time Output Fall Time Skew, between any output clocks
Symbol
tOR tOF
Conditions
Min.
0
Typ.
Max. Units
250 800 750 MHz ns ns ps
(Assumes identically loaded outputs with identical rise times, measured at VDDC/2) /1 /2 /3 /4
0
250
Propagation Delay
5.0 6.0 7.0 45 45 50 50 55 55
ns ns ns ns % %
Output Clock Duty Cycle for /2 and /4 Output Clock Duty Cycle for /1 and /3
Thermal Characteristics (16-pin TSSOP)
Parameter
Thermal Resistance Junction to Ambient
Symbol
JA JA JA JC
Conditions
Still air 1 m/s air flow 3 m/s air flow
Min.
Typ.
78 70 68 37
Max. Units
C/W C/W C/W C/W
Thermal Resistance Junction to Case
MDS 558-01 C In te grated Circuit Systems
4
525 Ra ce Street, San Jose, CA 9512 6
Revision 122105 tel (4 08) 297-1 201
w w w. i c s t . c o m
ICS558-01 PECL/CMOS TO CMOS CLOCK DIVIDER
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)
Package dimensions are kept current with JEDEC Publication No. 95, MO-153
16
Millimeters Symbol Min Max
Inches Min Max
E1 INDEX AREA
E
12 D
A A1 A2 b C D E E1 e L aaa
-1.20 0.05 0.15 0.80 1.05 0.19 0.30 0.09 0.20 4.90 5.1 6.40 BASIC 4.30 4.50 0.65 Basic 0.45 0.75 0 8 -0.10
-0.047 0.002 0.006 0.032 0.041 0.007 0.012 0.0035 0.008 0.193 0.201 0.252 BASIC 0.169 0.177 0.0256 Basic 0.018 0.030 0 8 -0.004
A2 A1
A
c
-Ce
b SEATING PLANE L
aaa C
Ordering Information
Part / Order Number
ICS558G-01 ICS558G-01T ICS558G-01LF ICS558G-01LFT
Marking
ICS558G-01 ICS558G-01 558G-01LF 558G-01LF
Shipping Packaging
Tubes Tape and Reel Tubes Tape and Reel
Package
16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP
Temperature
0 to +70C 0 to +70C 0 to +70C 0 to +70C
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments.
MDS 558-01 C In te grated Circuit Systems
5
525 Ra ce Street, San Jose, CA 9512 6
Revision 122105 tel (4 08) 297-1 201
w w w. i c s t . c o m


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